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[IEEE 2008 IEEE International Conference on Service Operations and Logistics, and Informatics - Beijing, China (2008.10.12-2008.10.15)] 2008 IEEE International Conference on Service Operations and Logistics, and Informatics - Experimental and numerical investigations on solder reliability for flip-chip BGA packaging
Ching-I Chen,, Cheng-Chung Lee,, Ching-Yu Ni,Year:
2008
Language:
english
DOI:
10.1109/soli.2008.4683003
File:
PDF, 3.63 MB
english, 2008