[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - An investigation on nanoscale bondability between Cu-Al intermetallic compound
Hsu, Hsiang-Chen, Chien, Jih-Hsin, Wang, Chen-Yi, Chu, Li-Ming, Ju, Shin-Pon, Fu, Shen-Li, Bai, Miin ShyanYear:
2013
Language:
english
DOI:
10.1109/impact.2013.6706686
File:
PDF, 933 KB
english, 2013