[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Fatigue strength around through hole in printed circuit board
Kinoshita, Takahiro, Iwade, Shogo, Shima, Shunpei, Kawakami, Takashi, Mizushina, Hideki, Iinaga, HiroshiYear:
2013
Language:
english
DOI:
10.1109/impact.2013.6706630
File:
PDF, 709 KB
english, 2013