[IEEE 2013 8th International Microsystems, Packaging,...

  • Main
  • [IEEE 2013 8th International...

[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Fatigue strength around through hole in printed circuit board

Kinoshita, Takahiro, Iwade, Shogo, Shima, Shunpei, Kawakami, Takashi, Mizushina, Hideki, Iinaga, Hiroshi
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2013
Language:
english
DOI:
10.1109/impact.2013.6706630
File:
PDF, 709 KB
english, 2013
Conversion to is in progress
Conversion to is failed