![](/img/cover-not-exists.png)
[IEEE The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems - Las Vegas, NV, USA (1-4 June 2004)] The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) - Alternative lead-free solder joint integrity under room temperature mechanical load
Phil Geng,, Aspandiar, R., Byrne, T., Pon, F., Daewoong Suh,, McAllister, A., Nazario, A., Paulraj, P., Armendariz, N., Martin, T., Worley, T.Year:
2004
Language:
english
DOI:
10.1109/itherm.2004.1318297
File:
PDF, 481 KB
english, 2004