The effect of solder paste viscosity on porosity and...

IEEE Transactions on Components Packaging and Manufacturing Technology Part B 1997 / 5 Vol. 20; Iss. 2

The effect of solder paste viscosity on porosity and mechanical properties of surface mount solder joints

Tian, Y., Chan, Y.C., Lai, J.K.L., Pak, S.T.F.
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Volume:
20
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.575566
Date:
May, 1997
File:
PDF, 300 KB
english, 1997
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