Product development and yield enhancement through failure analysis of integrated circuits with scanning capacitance microscopy
Tangyunyong, P., Nakakura, C. Y.Volume:
21
Year:
2003
Language:
english
Journal:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
DOI:
10.1116/1.1569925
File:
PDF, 912 KB
english, 2003