![](/img/cover-not-exists.png)
[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Implementation of a front-end-module by embedding a RF switch IC and a power amplifier in printed-circuit-board
Ryu, Jong-In, Park, Se-Hoon, Moon, Jong-Won, Kim, Dongsu, Kim, Jun Chul, Kang, NamkeeYear:
2009
Language:
english
DOI:
10.1109/ectc.2009.5074282
File:
PDF, 2.08 MB
english, 2009