[IEEE 2011 International Symposium on Advanced Packaging Materials (APM) - Xiamen, China (2011.10.25-2011.10.28)] 2011 International Symposium on Advanced Packaging Materials (APM) - Effect of surface finish (OSP and ENEPIG) on failure mechanism induced by electromigration in Sn-3.0Ag-0.5Cu flip chip solder interconnect
Huang, Mingliang, Chen, Leida, Zhou, Shaoming, Ye, SongYear:
2011
Language:
english
DOI:
10.1109/isapm.2011.6105720
File:
PDF, 615 KB
english, 2011