Mechanical effects of polishing pad in copper...

Current Applied Physics 2010 Vol. 10; Iss. 1

Mechanical effects of polishing pad in copper electrochemical mechanical deposition for planarization

Sukhoon Jeong, Sangjik Lee, Boumyoung Park, Hyoungjae Kim, Sungryul Kim, Haedo Jeong
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Volume:
10
Year:
2010
Language:
english
Pages:
6
DOI:
10.1016/j.cap.2009.06.011
File:
PDF, 511 KB
english, 2010
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