Evolution of Organic Chip Packaging Technology forHigh...

IEEE Transactions on Advanced Packaging 2004 / 02 Vol. 27; Iss. 1

Evolution of Organic Chip Packaging Technology forHigh Speed Applications

Klink, E., Garben, B., Huber, A., Kaller, D., Grivet-Talocia, S., Katopis, G.A.
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Volume:
27
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2004.825457
Date:
February, 2004
File:
PDF, 627 KB
english, 2004
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