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[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - 3D eWLB (embedded wafer level BGA) technology for 3D-packaging/3D-SiP (Systems-in-Package) applications
Yoon, Seung Wook, Bahr, A., Baraton, X., Marimuthu, Pandi Chelvam, Carson, FlynnYear:
2009
Language:
english
DOI:
10.1109/eptc.2009.5416412
File:
PDF, 882 KB
english, 2009