Development and evaluation of a Cu composite sheet with embedded high electric conduction path for new interconnect material
Je-sik Shin, Hyung-kwon Moon, Bong-hwan Kim, Kyung-hoon Kim, Hyo-soo Lee, Seung-boo Jung, Hyouk-chon KwonVolume:
11
Year:
2011
Language:
english
Pages:
1
DOI:
10.1016/j.cap.2010.11.113
File:
PDF, 926 KB
english, 2011