Development and evaluation of a Cu composite sheet with...

Development and evaluation of a Cu composite sheet with embedded high electric conduction path for new interconnect material

Je-sik Shin, Hyung-kwon Moon, Bong-hwan Kim, Kyung-hoon Kim, Hyo-soo Lee, Seung-boo Jung, Hyouk-chon Kwon
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
11
Year:
2011
Language:
english
Pages:
1
DOI:
10.1016/j.cap.2010.11.113
File:
PDF, 926 KB
english, 2011
Conversion to is in progress
Conversion to is failed