A simple model for the Mode I popcorn effect for IC packages with copper leadframe
Alpern, P., Kheng Chooi Lee,, Dudek, R., Tilgner, R.Volume:
25
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2002.1010021
Date:
June, 2002
File:
PDF, 302 KB
english, 2002