Wafer level microarcing model in 90 nm chemical-vapor...

Wafer level microarcing model in 90 nm chemical-vapor deposition low-k via etch on 300 mm silicon-on-insulator substrate

Cong, Hai, Low, Chun Hui, Pradeep, Yelehanka Ramachandramurthy, Zhang, Xin, Chandima, Perera, Liu, Wu Ping, Tan, Juan Boon, Hsia, Liang Choo
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Volume:
24
Year:
2006
Language:
english
Journal:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
DOI:
10.1116/1.2187990
File:
PDF, 1001 KB
english, 2006
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