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[IEEE 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2012.05.29-2012.06.1)] 2012 IEEE 62nd Electronic Components and Technology Conference - Cu wire and Pd-Cu wire package reliability and molding compounds
Abe, Hidenori, Kang, Dong Chul, Yamamoto, Takashi, Yagihashi, Takashi, Endo, Yoshinori, Saito, Hiroyuki, Horie, Takahiro, Tamate, Hironori, Ejiri, Yoshinori, Watanabe, Naoki, Iwasaki, TomioYear:
2012
Language:
english
DOI:
10.1109/ectc.2012.6248975
File:
PDF, 2.97 MB
english, 2012