[IEEE Electrical Performance of Electronic Packaging - Portland, OR, USA (25-27 Oct. 2004)] Electrical Performance of Electronic Packaging - Application of domain decomposition to the finite-element electromagnetic modeling of planar multi-layered interconnect structures & integrated passives
Hong Wu,, Cangellaris, A.C., An-Yu Kuo,Year:
2004
Language:
english
DOI:
10.1109/epep.2004.1407610
File:
PDF, 271 KB
english, 2004