Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders
Huang, M. L., Loeher, T., Ostmann, A., Reichl, H.Volume:
86
Year:
2005
Language:
english
Journal:
Applied Physics Letters
DOI:
10.1063/1.1925317
File:
PDF, 372 KB
english, 2005