[IEEE 2009 IEEE International Conference of Electron Devices and Solid-State Circuits (EDSSC 2009) - Xi'an (2009.12.25-2009.12.27)] 2009 IEEE International Conference of Electron Devices and Solid-State Circuits (EDSSC) - Superior contact properties of trench filled contact for 3D MOSFET

The file will be sent to your email address. It may take up to 1-5 minutes before you receive it.

The file will be sent to you via the Telegram messenger. It may take up to 1-5 minutes before you receive it.

Note: Make sure you have linked your account to Z-Library Telegram bot.

The file will be sent to your Kindle account. It may take up to 1–5 minutes before you receive it.

Please note: you need to verify every book you want to send to your Kindle. Check your mailbox for the verification email from Amazon Kindle.