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[IEEE 2008 International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2008.06.1-2008.06.4)] 2008 International Interconnect Technology Conference - Enhancing Yield and Reliability by Applying Dry Organic Acid Vapor Cleaning to Copper Contact Via-Bottom for 32-nm Nodes and Beyond
Kudo, H., Ishikawa, K., Nakaishi, M., Tsukune, A., Ozaki, S., Nakata, Y., Akiyama, S., Mizushima, Y., Hayashi, M., Akbar, Ade A., Kouno, T., Iwata, H., Iba, Y., Ohba, T., Futatsugi, T., Nakamura, T.,Year:
2008
Language:
english
DOI:
10.1109/iitc.2008.4546935
File:
PDF, 3.28 MB
english, 2008