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[IEEE 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, Jiangsu, China (2009.07.6-2009.07.10)] 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Failure analyses of 3D Sip (system-in-package) and WLP (wafer-level package) by finite element methods
Lau, John, Xiaowu Zheng,, Selvanayagam, CherylYear:
2009
Language:
english
DOI:
10.1109/ipfa.2009.5232687
File:
PDF, 14.51 MB
english, 2009