Novel Nonconductive Adhesives/Films With Carbon Nanotubes...

IEEE Transactions on Components and Packaging Technologies 2009 / 12 Vol. 32; Iss. 4

Novel Nonconductive Adhesives/Films With Carbon Nanotubes for High-Performance Interconnects

Hongjin Jiang,, Myung Jin Yim,, Wei Lin,, Wong, C.P.
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Volume:
32
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2009.2014742
Date:
December, 2009
File:
PDF, 1003 KB
english, 2009
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