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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Warpage and electrical performance of embedded device package, MCeP
Tanaka, Kouichi, Kurashima, Nobuyuki, Iizuka, Hajime, Ooi, Kiyoshi, Machida, Yoshihiro, Koyama, TetsuyaYear:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898691
File:
PDF, 1.07 MB
english, 2011