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[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Simulation of IMC layer growth and Cu consumption in Sn-Ag-xCu/Cu solder joints during reflow
Wang, Xiaohui, Huang, Mingliang, Yang, Fan, Zhao, NingYear:
2012
Language:
english
DOI:
10.1109/icept-hdp.2012.6474737
File:
PDF, 1.17 MB
english, 2012