Study on the pressurized underfill encapsulation of flip...

IEEE Transactions on Components Packaging and Manufacturing Technology Part B 1997 / Nov. Vol. 20; Iss. 4

Study on the pressurized underfill encapsulation of flip chips

Sejin Han,, Wang, K.K.
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Volume:
20
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.641512
Date:
January, 1997
File:
PDF, 241 KB
english, 1997
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