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Soldering with solid state and diode lasers: Energy coupling, temperature rise, process window
Brandner, M., Seibold, G., Chang, C., Dausinger, F., Hügel, H.Volume:
12
Year:
2000
Language:
english
Journal:
Journal of Laser Applications
DOI:
10.2351/1.1317551
File:
PDF, 1.15 MB
english, 2000