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[Hartung-Gorre Verlag ISPSD'94 International Symposium on Power Semiconductor Devices and IC's - Davos, Switzerland (31 May-2 June 1994)] Proceedings of the 6th International Symposium on Power Semiconductor Devices and Ics - Reduction of thermomechanical stress by applying a low temperature joining technique
Klaka, S., Sittig, R.Year:
1994
Language:
english
DOI:
10.1109/ispsd.1994.583736
File:
PDF, 522 KB
english, 1994