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[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Wafer level warpage modeling methodology and characterization of TSV wafers
Che, F. X., Li, H. Y., Zhang, Xiaowu, Gao, S., Teo, K. H.Year:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898662
File:
PDF, 1.18 MB
english, 2011