[IEEE 2013 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, China (2013.07.15-2013.07.19)] Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - The effect of Pb contamination on the solidification behaviors and mechanical properties of backward compatible solder joints
Li Xunping,, Zhou Bin,, En Yunfei,, He Xiaoqi,, Wei Xiongfeng,Year:
2013
Language:
english
DOI:
10.1109/ipfa.2013.6599239
File:
PDF, 1.60 MB
english, 2013