A compact multilayer IC package model for efficient...

IEEE Transactions on Advanced Packaging 2003 / 11 Vol. 26; Iss. 4

A compact multilayer IC package model for efficient simulation, analysis, and design of high-performance VLSI circuits

Yungseon Eo,, Eisenstadt, W.R., Woojin Jin,, Jinwoo Choi,, Jongin Shim,
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Volume:
26
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/tadvp.2003.821093
Date:
November, 2003
File:
PDF, 1020 KB
english, 2003
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