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[IEEE 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Belgium (2014.04.7-2014.04.9)] 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Reliability study on chip capacitor solder joints under thermo-mechanical and vibration loading
Meier, Karsten, Roellig, Mike, Schiessl, Andreas, Wolter, Klaus-JuergenYear:
2014
Language:
english
DOI:
10.1109/eurosime.2014.6813863
File:
PDF, 2.52 MB
english, 2014