Mini-Contact Enhanced Thermoelectric Cooling of Hot Spots...

IEEE Transactions on Components and Packaging Technologies 2007 / 09 Vol. 30; Iss. 3

Mini-Contact Enhanced Thermoelectric Cooling of Hot Spots in High Power Devices

Yang, Bao, Wang, Peng, Bar-Cohen, Avram
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Volume:
30
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2007.898744
Date:
September, 2007
File:
PDF, 490 KB
english, 2007
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