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Subcritical Delamination in Epoxy Bonds to Silicon and Glass Adherends: Effect of Temperature and Preconditioning
Singh, Hitendra K., Wan, Kai-Tak, Dillard, John G., Dillard, David A., Reboa, Paul, Smith, Joshua, Chappell, Ellen, Sharan, AlokVolume:
84
Language:
english
Journal:
The Journal of Adhesion
DOI:
10.1080/00218460802255509
Date:
August, 2008
File:
PDF, 1.03 MB
english, 2008