[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Stress analysis during assembly and packaging
Schreier-Alt, Thomas, Unterhofer, Katrin, Ansorge, Frank, Lang, Klaus-DieterYear:
2011
Language:
english
DOI:
10.1109/ectc.2011.5898738
File:
PDF, 2.64 MB
english, 2011