[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2008.07.28-2008.07.31)] 2008 International Conference on Electronic Packaging Technology & High Density Packaging - Study of interface reliability in QFN device under hygro-thermal environment
Jiang, Ting-biao, Nong, Hong-mi, Du, ChaoYear:
2008
Language:
english
DOI:
10.1109/icept.2008.4607146
File:
PDF, 3.57 MB
english, 2008