Moisture sensitivity and reliability of plastic thermally...

IEEE Transactions on Components Packaging and Manufacturing Technology Part B 1995 / Aug. Vol. 18; Iss. 3

Moisture sensitivity and reliability of plastic thermally enhanced QFP packages

Yip, L.
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Volume:
18
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.404106
Date:
January, 1995
File:
PDF, 527 KB
english, 1995
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