[IEEE International Electron Devices Meeting. IEDM Technical Digest - Washington, DC, USA (7-10 Dec. 1997)] International Electron Devices Meeting. IEDM Technical Digest - Damascene integration of copper and ultra-low-k xerogel for high performance interconnects
Zielinski, E.M., Russell, S.W., List, R.S., Wilson, A.M., Jin, C., Newton, K.J., Lu, J.P., Hurd, T., Hsu, W.Y., Cordasco, V., Gopikanth, M., Korthuis, V., Lee, W., Cerny, G., Russell, N.M., Smith, P.BYear:
1997
Language:
english
DOI:
10.1109/iedm.1997.650536
File:
PDF, 428 KB
english, 1997