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[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - Phase field simulation of solidification behavior and microstructure evolution of Sn-58Bi/Cu solder interconnect during reflow soldering process
Ma, Wen-Jing, Ke, Chang-Bo, Zhou, Min-Bo, Zhang, Xin-PingYear:
2013
Language:
english
DOI:
10.1109/icept.2013.6756482
File:
PDF, 858 KB
english, 2013