Effective repair to ultra-low-k dielectric material (k∼2.0)...

Effective repair to ultra-low-k dielectric material (k∼2.0) by hexamethyldisilazane treatment

Mor, Y. S., Chang, T. C., Liu, P. T., Tsai, T. M., Chen, C. W., Yan, S. T., Chu, C. J., Wu, W. F., Pan, F. M., Lur, Water, Sze, S. M.
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Volume:
20
Year:
2002
Language:
english
Journal:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
DOI:
10.1116/1.1488645
File:
PDF, 376 KB
english, 2002
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