[IEEE 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Improvement in moisture resistance of thin SiP utilizing the plasma treatment of resin surface
Kohara, Y., Usui, R., Nishida, A., Mizuhara, H., Nakarrwra, T., Mori, S., Takakusaki, N., Igarashi, Y., Inoue, Y.Year:
2004
Language:
english
DOI:
10.1109/eptc.2004.1396593
File:
PDF, 460 KB
english, 2004