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[IEEE 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Penang, Malaysia (2008.11.4-2008.11.6)] 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Lead-free solder ball attach improvement on FCPBGA with SOP pad finishing
Wong Tzu Ling,, Eu Poh Leng,, Nowshad Amin,, Ibrahim Ahmad,Year:
2008
Language:
english
DOI:
10.1109/iemt.2008.5507837
File:
PDF, 423 KB
english, 2008