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Temperature Study of Sub-Micrometric ICs by Scanning...

IEEE Transactions on Components and Packaging Technologies 2007 / 09 Vol. 30; Iss. 3

Temperature Study of Sub-Micrometric ICs by Scanning Thermal Microscopy

Gomes, Severine, Chapuis, Pierre-Olivier, Nepveu, F., Trannoy, N., Volz, S., Charlot, B., Tessier, G., Dilhaire, S., Cretin, B., Vairac, P.
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Volume:
30
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2007.901748
Date:
September, 2007
File:
PDF, 3.60 MB
english, 2007
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