[IEEE 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM) - Orlando, FL, USA (2008.05.28-2008.05.31)] 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Strain-rate-dependant mechanical properties for Sn-3.8Ag-0.7Cu and SAC-X solder alloy
Luhua Xu,, Kok Ee Tan,, Pang, John H.L.Year:
2008
Language:
english
DOI:
10.1109/itherm.2008.4544328
File:
PDF, 252 KB
english, 2008