Reduced electromigration of Cu wires by surface coating

Hu, C.-K., Gignac, L., Rosenberg, R., Liniger, E., Rubino, J., Sambucetti, C., Domenicucci, A., Chen, X., Stamper, A. K.

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Volume:

Year:

2002

Language:

english

Journal:

Applied Physics Letters

DOI:

10.1063/1.1504491

File:

PDF, 399 KB

english, 2002

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