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Reduced electromigration of Cu wires by surface coating
Hu, C.-K., Gignac, L., Rosenberg, R., Liniger, E., Rubino, J., Sambucetti, C., Domenicucci, A., Chen, X., Stamper, A. K.Volume:
81
Year:
2002
Language:
english
Journal:
Applied Physics Letters
DOI:
10.1063/1.1504491
File:
PDF, 399 KB
english, 2002