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[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Reliability and shear strength of 42Sn-57Bi-1Ag (wt.%) lead-free solder joints after thermal aging and salt spray testing
Mostofizadeh, M., Pippola, J., Frisk, L.Year:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575696
File:
PDF, 3.04 MB
english, 2013