Distribution of a minor solid constituent in a transfer...

IEEE Transactions on Components and Packaging Technologies 2005 / 09 Vol. 28; Iss. 3

Distribution of a minor solid constituent in a transfer molded e-pad leadframe package

Yue Huang,, Sheng Zhan,, Bigio, D., Pecht, M.G.
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Volume:
28
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2005.848579
Date:
September, 2005
File:
PDF, 997 KB
english, 2005
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