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[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - Scaling effect of device area and film thickness on electrical and reliability characteristics of RRAM
Lee, Joonmyoung, Park, Jubong, Jung, Seungjae, Hwang, HyunsangYear:
2011
Language:
english
DOI:
10.1109/iitc.2011.5940297
File:
PDF, 465 KB
english, 2011