![](/img/cover-not-exists.png)
[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Flip Chip bonding with Elasticity Bonding System and Non Conductive Film suitable for intermetallic compounds formation
Kojima, Ryoji, Saito, Takayuki, Matsumura, Takashi, Koyama, Taichi, Umetsu, Norio, Furuta, Kazutaka, Nishimura, Junichi, Moriyama, HironobuYear:
2010
Language:
english
DOI:
10.1109/estc.2010.5642868
File:
PDF, 1.41 MB
english, 2010