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[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Reflow influence for Sn96.7-Ag3.7 polymer core solder ball in BGA package
Shih, Tien-Tsorng, Chen, Bing-Hua, Lee, Win-Der, Wang, Mu-ChunYear:
2011
Language:
english
DOI:
10.1109/impact.2011.6117248
File:
PDF, 1.06 MB
english, 2011