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[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Reliability test and IMC investigation of lead and lead free solder joints on different surface finish processes
Yun Peng Ho,, Jen Tsung Luo,, Keven Hsu,, Arthur Chen,Year:
2009
Language:
english
DOI:
10.1109/impact.2009.5382266
File:
PDF, 1.66 MB
english, 2009