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[IEEE International Conference on Plasma Science (papers in summary form only received) - Madison, WI, USA (1995.06.5-1995.06.8)] International Conference on Plasma Science (papers in summary form only received) - Reactive ion etching of via holes for GaAs HEMTs and MMICs using Cl/sub 2//BCl/sub 3//Ar gas mixtures
Nordheden, K.J., Ferguson, D.W., Smith, P.M.Year:
1995
Language:
english
DOI:
10.1109/plasma.1995.531668
File:
PDF, 125 KB
english, 1995